Soldering & Cleaning

Soldering & Cleaning

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Model : TSF-6522
Type : Soldering & Cleaning
Maker : Soldering
Simple Explanation
Stencil life: 8 hours (process dependent).
Excellent printing characteristics to <16mil pitch.
Leaves bright/shiny solder joints after reflow.
Can reflow in air or nitrogen environments.
Classified as ROL1 per J-STD-004.
Compliant to Bellcore GR-78.

Product Description

Kester TSF-6522 is a no-clean tacky soldering flux formula designed to be used with a rotating disc, a doctor blade, or a drum fluxer. Kester TSF-6522 can also be used in dot dispensing for BGA/PGA sites or in a rework application for surface mount packages. Kester TSF-6522 maintains its activity and dispensing characteristics for up to 8 hours and can be used in a wide range of temperature and humidity conditions. Kester maintains the highest standards by manufacturing TSF-6522 under a vacuum environment.


Physical Properties

Viscosity (typical): 100 poise

Malcom Viscometer @ 10rpm and 25°C

Initial Tackiness (typical): 117 grams

Tested to J-STD-005, IPC-TM-650, Method 2.4.44

Acid Number: 89.0 mg KOH/g of flux 

Tested to J-STD-004, IPC-TM-650, Method 2.3.13


Recommended Reflow Profiles

Optimal activation temperatures are 130-185°C (266-365°F). See "Soak Zone" in diagrams below.