Soldering & Cleaning

Soldering & Cleaning

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Model : TSF-6522RH
Type : Soldering & Cleaning
Maker : Soldering
Simple Explanation
High tack values and long tack life.
Leaves bright/shiny solder joints after reflow.
Can reflow in air or nitrogen environments.

Product Description

Kester’s TSF-6522RH is a rosin based no-clean tacky soldering flux formula designed to be compliant with IEC 61249-2-21 definition for halide free materials. TSF-6522RH is a formula being marketed for customers familiar with Kester’s TSF-6522 formula, but now must comply with new halide free legislation. TSF-6522RH can be used with doctor blade, or a drum fluxer. Kester’s TSF-6522RH can also be used in dot dispensing for BGA/PGA sites or in a rework application for surface mount packages.


RoHS Compliance

This product meets all the requirements of the RoHS (Restriction of Hazardous Substances) Directive, 2002/95/EC Article 4 for the stated banned substances.


Physical Properties (typical)

Viscosity Range: 240 +/-75 poise

Kester Method #1W-QC-3-09

Tackiness (grams-force): 96 +/- 38 gF

Kester Method #1W-QC-3-04

Acid Number: 76 +/- 5 mg KOH / gm

Kester Method #1W-QC-G-01

Color: Amber

Kester Method #1W-QC-G-18

Halogens: 650 ppm theorectical in the flux


Reflow Profile