Soldering & Cleaning

Soldering & Cleaning

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Model : TSF-6592LV
Type : Soldering & Cleaning
Maker : Soldering
Simple Explanation
Compatible with Lead Free alloys such as SnAg, SnCu,SnAgCu, SnAgBi.
Reflow-able with peak temperatures up to 270 °C.
Reflow-able in air and nitrogen.
Bright shiny soldered joints with clear residues.
Aggressive flux on various substrates suchas OSPCu,Immersion finishes and ENIG.
Clear non-tacky residues.
High tack to minimize skewing of components.
Low voiding.
Stencil Life of 8+ hours (process dependent).
Classified as ROL0 per J-STD-004.
Compliant to Bellcore GR-78.
Product Description

Kester TSF-6592LV is a No Clean Paste Flux designed as a Lead Free Solution for an array of Lead Free interconnect applications such as flip chip attach, sphere or ball attach, rework/repair of CSPs, BGAs, SMDs, or any Lead Free soldering application that requires a very tacky flux. It has been optimized for consistent high speed printing applications.


RoHS Compliance

This product meets the requirements of the RoHS(Restriction of Hazardous Substances) Directive, 2002/95/EC Article 4 for the stated banned Substances.


Physical Properties

Viscosity (Typical): 235 poise

Malcom Viscometer @ 10rpm and 25°C

Tackiness (Typical): 100 grams

Tested to J-STD-005, IPC-TM-650, Method 2.4.44

Acid Number: 85 mg KOH/g of flux

Tested to J-STD-004, IPC-TM-650, Method 2.3.13


Recommended Reflow Profiles:

The recommended convection reflow profile for TSF-6592LV for Sn96.5Ag3.5, Sn99.3Cu0.7, or the various SnAgCu alloys is shown here. This profile is simply a guideline. As TSF-6592LV was engineered to be a versatile, robust interconnect material other reflow profiles would be effective. Your optimal profile may be different from the one shown based on your oven, component design, fixturing and mix of defects. Please contact Kester if you need additional profiling advice.