Product Description
EnviroMarkTM 907 is a lead-free, air and nitrogen breflowable no-clean solder paste specifically designed for the thermal requirements of lead free alloys, including the Sn96.5Ag3.0Cu0.5 alloy. The paste flux system allows joint appearances that closely resemble that achieved with SnPb alloys. EM907 is capable of stencil printing downtimes up to 60 minutes with an effective first print down to 20 mils without any kneading. EM907 also exhibits excellent continual printability for fine pitch (0.4mm/16 mils) and is able to print at high speeds up to 6”/s (150 mm/s). This solder paste also exceeds the reliability standards required by J-STD-004.

Standard Applications
88.5% Metal ? Stencil Printing

RoHS Compliance
This product meets the requirements of the RoHS (Restriction of Hazardous Substances) Directive, 2002/95/EC Article 4 for the stated banned substances.

Physical Properties
(Data given for Sn96.5 Ag3.0 Cu0.5, 88.5% metal, -325+500 mesh)
Viscosity (typical): 1800 poise
Malcom viscometer @ 10rpm and 25°C
Initial Tackiness (typical): 44 grams
Tested to J-STD-005, IPC-TM-650, Method 2.4.44
Slump Test: Pass
Tested to J-STD-005, IPC-TM-650, Method 2.4.35
Solder Ball Test: Pass
Tested to J-STD-005, IPC-TM-650, Method 2.4.43
Wetting Test: Pass
Tested to J-STD-005, IPC-TM-650, Method 2.4.45

Recommended Reflow Profile:
Full convection reflow method is most commonly used to reflow the EM907 formula.The recommended convection reflow profile for EM907 made with either the Sn96.5Ag3.5 or SnAgCu alloys is shown here.